pb rohs epsa12bbhg-7.3728m tr epsa12 b b h g -7.3728m tr series rohs compliant (pb-free) 2.5v 4 pad 5mm x 7mm ceramic smd lvcmos programmable spread spectrum oscillator frequency tolerance/stability 50ppm maximum operating temperature range -40c to +85c packaging options tape & reel nominal frequency 7.3728mhz spread spectrum -0.50% down spread output control function tri-state electrical specifications nominal frequency 7.3728mhz frequency tolerance/stability 50ppm maximum (inclusive of all conditions: frequency stability over the operating temperature range, supply voltage change, output load change, first year aging at 25c, shock, and vibration.) operating temperature range -40c to +85c supply voltage 2.5vdc 5% maximum supply voltage -0.5vdc to +3.2vdc input current 15ma maximum output voltage logic high (voh) 90% of vdd minimum (ioh=-8ma) output voltage logic low (vol) 10% of vdd maximum (iol=+8ma) rise/fall time 3nsec maximum (measured at 10% to 90% of waveform) duty cycle 50% 5(%) (measured at 50% of waveform) load drive capability 15pf maximum output logic type cmos output control function tri-state (disabled output: high impedance) tri-state input voltage (vih and vil) 70% of vdd minimum or no connection to enable output, 30% of vdd maximum to disable output tri-state output disable time 100nsec maximum tri-state output enable time 100nsec maximum disable current 20ma maximum (unloaded; pad 1=ground) spread spectrum -0.50% down spread modulation frequency 30khz minimum, 32khz typical, 45khz maximum period jitter 100psec maximum (cycle to cycle; spread spectrum-on) start up time 10msec maximum storage temperature range -55c to +125c environmental & mechanical specifications esd susceptibility mil-std-883, method 3015, class 1, hbm: 1500v fine leak test mil-std-883, method 1014, condition a flammability ul94-v0 gross leak test mil-std-883, method 1014, condition c mechanical shock mil-std-883, method 2002, condition b moisture resistance mil-std-883, method 1004 moisture sensitivity j-std-020, msl 1 resistance to soldering heat mil-std-202, method 210, condition k resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010, condition b vibration mil-std-883, method 2007, condition a www.ecliptek.com | specification subject to change without notice | rev a 3/12/2011 | page 1 of 6
epsa12bbhg-7.3728m tr mechanical dimensions (all dimensions in millimeters) pin connection 1 tri-state 2 case ground 3 output 4 supply voltage line marking 1 ecliptek 2 7.3728m 3 sxxxxx s=configuration designator xxxxx=ecliptek manufacturing identifier 2.88 1.81 2.0 (x4) 2.2 (x4) www.ecliptek.com | specification subject to change without notice | rev a 3/12/2011 | page 2 of 6 1.60 0.20 5.00 0.15 7.00 0.15 marking orient a tion 3.68 0.15 1.4 0.1 1.4 0.2 2.20 0.15 5.08 0.15 1 2 3 4 all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x4) all dimensions in millimeters
epsa12bbhg-7.3728m tr www.ecliptek.com | specification subject to change without notice | rev a 3/12/2011 | page 3 of 6 output disable (high imped ance st a te) output w a veform & timing dia gram v oh v ol 90% of w a v ef or m 50% of w a v ef or m 10% of w a v ef or m f all time rise time t w t duty cycle (%) = t w /t x 100 v ih v il t plz t pzl clock output tri-st a te input supply v oltage (v dd ) t est cir cuit f or cmos output output t r i-state or p o w er do wn ground + + + _ _ _ p o w er supply 0.01 f (note 1) 0.1 f (note 1) c l (note 3) note 1: an e xter nal 0.01 f cer amic b ypass capacitor in par allel with a 0.1 f high frequency cer amic b ypass capacitor close (less than 2mm) to the pac kage g round and supply v oltage pin is required. note 2: a lo w input capacitance (<12pf), 10x attentuation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue cl includes sum of all probe and fixture capacitance . see applicab le specification sheet f or ? load dr iv e capability ? . v oltage meter current meter oscilloscope f requency counter probe (note 2)
dia 50 min dia 20.2 min dia 13.0 0.2 2.5 min width 10.0 min depth t ape slot in core f or t ape star t dia 40 min access hole at slot location 1.5 min tape & reel dimensions *compliant to eia 481a epsa12bbhg-7.3728m tr 16.0 +0.3/-0.1 7.5 0.1 6.75 0.10 4.0 0.1 2.0 0.1 8.0 0.1 b0* 1.5 +0.1/-0.0 a0* 0.30 0.05 k0* 22.4 max 360 max quantity per reel: 1,000 units 16.4 +2/-0 www.ecliptek.com | specification subject to change without notice | rev a 3/12/2011 | page 4 of 6
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods epsa12bbhg-7.3728m tr high temperature infrared/convection ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 additional notes temperatures shown are applied to body of device. www.ecliptek.com | specification subject to change without notice | rev a 3/12/2011 | page 5 of 6
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods epsa12bbhg-7.3728m tr low temperature infrared/convection 240c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 60 - 120 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 240c maximum target peak temperature (tp target) 240c maximum 1 time / 230c maximum 2 times time within 5c of actual peak (tp) 10 seconds maximum 2 times / 80 seconds maximum 1 time ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 additional notes temperatures shown are applied to body of device. low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. (temperatures shown are applied to body of device.) high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. (temperatures shown are applied to body of device.) www.ecliptek.com | specification subject to change without notice | rev a 3/12/2011 | page 6 of 6
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